Marcel B Wieland

Title: Marcel B Wieland: Innovator in Chip Module Design

Introduction

Marcel B Wieland is a notable inventor based in Radebeul, Germany. He has made significant contributions to the field of integrated circuit design, holding 2 patents that showcase his innovative approach to chip module structures.

Latest Patents

Wieland's latest patents include a "Chip module structure and method and system for chip module design using chip-package co-optimization." This invention involves a chip module that integrates a radio frequency integrated circuit (RFIC) chip and a package. The design process allows for the RF front end to be split between the chip and the package, enhancing performance through complex power matching. This iterative design process leads to reduced power requirements and enables device size scaling.

Another significant patent is for an "Integrated circuit structure with dielectric material to cover horizontally separated metal layers." This invention provides an IC structure that includes multiple metal layers separated by dielectric material, optimizing the overall design and functionality of integrated circuits.

Career Highlights

Marcel B Wieland is currently employed at Globalfoundries Dresden Module One Limited Liability Company & Co. Kg. His work focuses on advancing chip design technologies, contributing to the efficiency and performance of integrated circuits.

Collaborations

Wieland has collaborated with notable colleagues such as Saquib B Halim and Frank G Kuechenmeister, further enhancing the innovative environment in which he works.

Conclusion

Marcel B Wieland's contributions to chip module design and integrated circuit technology reflect his commitment to innovation in the field. His patents demonstrate a forward-thinking approach that continues to influence the industry.