The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 17, 2023
Filed:
Mar. 05, 2020
Globalfoundries Dresden Module One Limited Liability Company & Co. KG, Dresden, DE;
Frank G. Küchenmeister, Dresden, DE;
Marcel B. Wieland, Dresden, DE;
Hartmuth Daniel Kunze, Ottendorf-Okrilla, DE;
Lothar E. Lehmann, Radebeul, DE;
Sven Bedürftig, Laubusch, DE;
Patrick Rohlfs, Dresden, DE;
Abstract
Embodiments of the disclosure provide an integrated circuit (IC) structure. The IC structure may include a first metal layer on a substrate, and a second metal layer on the substrate that is horizontally separated from the first metal layer. A dielectric material may include a first portion on the first metal layer, and having a first upper surface, a second portion on the second metal layer, and having a second upper surface, and a third portion on the substrate between the first metal layer and the second metal layer. The third portion of the dielectric material includes a third upper surface above the first upper surface of the first portion and the second upper surface of the second portion of the dielectric material.