Company Filing History:
Years Active: 2023
Title: Patrick Rohlfs - Innovator in Integrated Circuit Technology
Introduction
Patrick Rohlfs is a notable inventor based in Dresden, Germany. He has made significant contributions to the field of integrated circuit technology. His innovative work has led to the development of a unique patent that enhances the functionality of integrated circuits.
Latest Patents
Patrick Rohlfs holds a patent for an "Integrated circuit structure with dielectric material to cover horizontally separated metal layers." This patent describes an integrated circuit (IC) structure that includes a first metal layer on a substrate and a second metal layer that is horizontally separated from the first. The dielectric material in this structure consists of multiple portions, ensuring effective coverage and performance of the metal layers.
Career Highlights
Rohlfs is associated with Globalfoundries Dresden Module One Limited Liability Company & Co. Kg, where he applies his expertise in integrated circuit design and development. His work has been instrumental in advancing the capabilities of modern electronic devices.
Collaborations
Throughout his career, Patrick has collaborated with talented professionals, including Frank G Küchenmeister and Marcel B Wieland. These collaborations have fostered innovation and contributed to the success of various projects within the company.
Conclusion
Patrick Rohlfs is a distinguished inventor whose work in integrated circuit technology has made a lasting impact. His patent and collaborations reflect his commitment to advancing the field and enhancing electronic device performance.