This inventor holds 3 USPTO granted patents and 2 published patent applications. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2022-2025.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2022-2025
Title: Mao-Jung Chiu: Innovator in Box Erecting Technology
Introduction
Mao-Jung Chiu is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of packaging technology, particularly in the development of box erecting apparatuses. With a total of three patents to his name, Chiu's work exemplifies innovation in automation and efficiency.
Latest Patents
Chiu's latest patent is a box erecting apparatus and method. This invention involves an apparatus designed to expand a box blank into a fully formed box. The apparatus includes an arm assembly, a controller, a camera, and a box blank conveyor. The arm assembly features a folding arm that can adjust its position and rotational angle based on the controller's input. This input is determined by the position of a feature of the box blank, which is captured by the camera. The images taken by the camera are crucial for positioning the arm assembly accurately and for assessing whether a box blank should be rejected.
Career Highlights
Mao-Jung Chiu is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His role involves leveraging his expertise in automation to enhance packaging processes. Chiu's innovative spirit and technical skills have made him a valuable asset to his company.
Collaborations
Chiu has collaborated with several talented individuals in his field, including Szu-Chen Huang and Fu-Hsien Li. These collaborations have fostered a creative environment that encourages the development of cutting-edge technologies.
Conclusion
Mao-Jung Chiu's contributions to the field of box erecting technology highlight his innovative approach and dedication to improving packaging processes. His patents reflect a commitment to advancing automation in the industry.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile