Endicott, NY, United States of America

Manh-Quan Tam Nguyen


Average Co-Inventor Count = 3.1

ph-index = 4

Forward Citations = 142(Granted Patents)


Company Filing History:


Years Active: 2003-2006

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8 patents (USPTO):

Title: Innovations by Manh-Quan Tam Nguyen

Introduction

Manh-Quan Tam Nguyen is a notable inventor based in Endicott, NY (US). He has made significant contributions to the field of electronic packaging and circuit design, holding a total of eight patents. His work focuses on improving the reliability and efficiency of electronic components.

Latest Patents

One of his latest patents is titled "Model for modifying drill data to predict hole locations in a panel structure." This invention involves creating a mathematical model that determines work locations in multi-layered laminated circuit panels. The model accounts for translational and rotational compensations due to stretching or shrinking of the panel, ensuring accurate predictions of hole or via locations. Another significant patent is "Electronic package with filled blind vias." This innovation enhances the density of electronic packaging and the electrical reliability of sub-assemblies by utilizing blind, landless vias in dielectric layers laminated to a conductive metal core.

Career Highlights

Manh-Quan Tam Nguyen is currently employed at International Business Machines Corporation (IBM). His work at IBM has allowed him to develop cutting-edge technologies that advance the field of electronics and circuit design. His patents reflect his commitment to innovation and excellence in engineering.

Collaborations

Throughout his career, Nguyen has collaborated with notable colleagues, including Frank Daniel Egitto and Voya Rista Markovich. These collaborations have contributed to the development of advanced technologies in the electronics sector.

Conclusion

Manh-Quan Tam Nguyen's contributions to the field of electronic packaging and circuit design are significant. His innovative patents demonstrate his expertise and commitment to advancing technology. His work continues to influence the industry and inspire future innovations.

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