The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 19, 2005

Filed:

Oct. 01, 2002
Applicants:

Frank D. Egitto, Binghamton, NY (US);

Keith J. Miller, Endicott, NY (US);

Manh-quan T. Nguyen, Endicott, NY (US);

Inventors:

Frank D. Egitto, Binghamton, NY (US);

Keith J. Miller, Endicott, NY (US);

Manh-Quan T. Nguyen, Endicott, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01R012/00 ;
U.S. Cl.
CPC ...
Abstract

A structure and method to establish an electrical connection between a tester and an electrical component. A flexible dielectric layer has a first side and a second side. A through via extends through the first side and the second side of the dielectric layer. A blind via is placed in a position that is offset from the through via and extends laterally in a first direction from a section of the first through via to a section of the flexible dielectric layer. The blind via extends in a second direction from the first side of the flexible dielectric layer to a section of the flexible dielectric layer that is between the first side and the second side of the dielectric layer. An electrically conductive member extends through the through via and extends into the blind via, thereby filling the through via and the blind via. The electrically conductive member has a first surface and a second surface. Any distance between the first surface and the second surface is greater than a distance between the first side of the dielectric layer and the second side of the dielectric layer.


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