This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Qualcomm Incorporated. Active years: 2024.
Company Filing History:
Years Active: 2024
Title: Manav Shah - Innovator in Modular Die Designs
Introduction
Manav Shah is a prominent inventor based in San Diego, California. He is known for his innovative contributions to the field of modular die designs. His work focuses on enhancing the capabilities and flexibility of chiplet technology, which is crucial in modern computing.
Latest Patents
Manav Shah holds a patent titled "Interconnections for Modular Die Designs." This patent discloses a method for designing and testing chiplets for suitability. Once a chiplet design is approved, multiple chiplets can be coupled together within a multi-die package to achieve desired computing capabilities. Each chiplet is assigned a unique identifier, allowing it to understand how to interface with other chiplets, ensuring proper signal routing. This modular approach reduces testing requirements and non-recurring expenses while increasing design flexibility.
Career Highlights
Manav Shah is currently employed at Qualcomm Incorporated, a leading company in the telecommunications and semiconductor industry. His work at Qualcomm has positioned him as a key player in advancing chiplet technology, which is essential for the development of next-generation computing systems.
Collaborations
Manav collaborates with talented professionals in his field, including Siddharth Kamdar and Christophe Avoinne. Their combined expertise contributes to the innovative projects at Qualcomm, fostering a collaborative environment that drives technological advancements.
Conclusion
Manav Shah's contributions to modular die designs exemplify the spirit of innovation in the tech industry. His patent and work at Qualcomm highlight the importance of flexibility and efficiency in modern computing solutions.