The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 30, 2024
Filed:
Mar. 22, 2022
Qualcomm Incorporated, San Diego, CA (US);
Siddharth Kamdar, San Diego, CA (US);
Christophe Avoinne, San Diego, CA (US);
Sanjay Jaisingh Arya, New Delhi, IN;
Manav Shah, San Diego, CA (US);
QUALCOMM Incorporated, San Diego, CA (US);
Abstract
Interconnections for modular die designs are disclosed. In one aspect, a die that is a chiplet is designed and tested for suitability. After approval of the chiplet design, multiple dies or chiplets may be coupled together within a multi-die package to form a package having desired computing capabilities. After assembly, each chiplet is provided a unique identifier, such as by setting a fuse. Based on the unique identifier, each chiplet is made aware of how interfaces to other chiplets are configured so that signals may be routed appropriately. Using modular chiplets in this fashion reduces testing requirements and non-recurring expenses while increasing flexibility for design options.