Gunma, Japan

Manabu Satomi

This inventor holds 1 USPTO granted patent. Top assignee: Taiyo Yuden Co., Ltd.. Active years: 2004.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Manabu Satomi. Retrieved from https://idiyas.com/inventor/manabu-satomi

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2004

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1 patent (USPTO):Explore Patents

Title: Manabu Satomi: Innovator in Composite Module Technology

Introduction

Manabu Satomi is a distinguished inventor based in Gunma, Japan. He is known for his innovative contributions to the field of composite modules, particularly in the development of technologies that enhance functionality while minimizing costs and power consumption.

Latest Patents

Satomi holds a patent for a composite module and its production process. This invention allows for multiple functions, miniaturization, low power consumption, and low costs without requiring any external chip parts. The technology involves embedding a high-frequency integrated circuit in a silicon substrate, along with a high-frequency high-capacity bypass capacitor and a matching coil formed using thin films of different materials. These elements are interconnected via a wiring layer, showcasing a significant advancement in integrated circuit design.

Career Highlights

Manabu Satomi is currently employed at Taiyo Yuden Co., Ltd., where he continues to push the boundaries of innovation in electronic components. His work has been instrumental in developing solutions that meet the demands of modern technology.

Collaborations

Some of his notable coworkers include Kenichi Ota and Masayuki Fujimoto, who have collaborated with him on various projects within the company.

Conclusion

Manabu Satomi's contributions to composite module technology exemplify the spirit of innovation in the electronics industry. His work not only enhances the functionality of devices but also paves the way for future advancements in integrated circuit design.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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