The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 09, 2004
Filed:
Dec. 06, 2002
Applicant:
Inventors:
Assignee:
Taiyo Yuden Co., Ltd., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/900 ;
U.S. Cl.
CPC ...
H01L 2/900 ;
Abstract
A composite module and its production process which allow multiple functions, miniaturization, low power consumption and low costs without requiring any external chip parts at all. A high-frequency integrated circuit is embedded in a silicon substrate, a high-frequency high-capacity bypass capacitor and a matching coil using thin films of different types of materials are also formed on the silicon substrate, a high-frequency high-capacity bypass capacitor is further formed with an interlayer insulation film between them, and these elements and the high-frequency integrated circuit are connected via a wiring layer.