Katsuta, Japan

Makoto Matsunaga


Average Co-Inventor Count = 9.5

ph-index = 2

Forward Citations = 54(Granted Patents)


Company Filing History:


Years Active: 1986

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2 patents (USPTO):Explore Patents

Title: The Innovative Mind of Makoto Matsunaga

Introduction

Makoto Matsunaga, an accomplished inventor based in Katsuta, Japan, has made significant contributions to the field of printed circuit board technology. With a total of two patents to his name, his work demonstrates a commitment to enhancing the efficiency and functionality of electronic components.

Latest Patents

Matsunaga's latest innovations include a patent for a printed circuit board and a process for preparing it, which involves the use of a catalyst for electroless plating deposition. This circuit board is designed with an insulating board that is treated to prevent the catalyst from ionizing, thus ensuring better insulation resistance even after moisture absorption. His other patent details a method for manufacturing a printed wiring board, particularly beneficial for printed coils. This method enables the formation of a conductor circuit layer that is thicker than an extremely thin insulating layer, allowing for high circuit density in the component layers.

Career Highlights

Matsunaga has been associated with Hitachi, Ltd., a prominent company known for its technological advancements and innovation. His patents reflect his expertise in developing solutions that simplify manufacturing processes and enhance the performance of electronic components.

Collaborations

Throughout his career, Matsunaga has had the opportunity to work alongside talented colleagues such as Kanji Murakami and Haruo Akahoshi. Their collaborative efforts have undoubtedly contributed to the successful outcomes of their projects and innovations.

Conclusion

In summary, Makoto Matsunaga stands out as a notable inventor in the realm of printed circuit board technology. His innovative patents and collaborations with esteemed coworkers reflect his dedication to pushing the boundaries of technology and improving the efficiencies of electronic components in the industry.

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