The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 05, 1986
Filed:
Jan. 08, 1985
Kanji Murakami, Mito, JP;
Haruo Akahoshi, Hitachi, JP;
Mineo Kawamoto, Hitachi, JP;
Motoyo Wajima, Hitachi, JP;
Yoichi Matsuda, Hitachi, JP;
Kyoji Kawakubo, Naka, JP;
Minoru Kanechiku, Katsuta, JP;
Toyofusa Yoshimura, Naka, JP;
Makoto Matsunaga, Katsuta, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
This invention concerns a method for the manufacture of a printed wiring board which particularly proves useful as a printed coil. This method is characterized by the fact that in the work in process which has undergone the step for formation of a conductor circuit and which has not undergone the step for separation of a plating resist, the plating resist and other insulating substratal material are separated for transfer from the surface of the substrate having the conductor circuit formed thereon. Since this method permits formation of an extremely thin insulating layer and a conductor circuit layer thicker than the insulating layer, it enables production of very thin printed wiring board and printed coil having high circuit density in the surfaces of component layers as well as in the direction of superposition of component layers.