The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 09, 1986
Filed:
Sep. 28, 1984
Mineo Kawamoto, Hitachi, JP;
Kanji Murakami, Mito, JP;
Haruo Akahoshi, Hitachi, JP;
Yoichi Matsuda, Hitachi, JP;
Motoyo Wajima, Hitachi, JP;
Makoto Matsunaga, Katsuta, JP;
Shoji Kawakubo, Ibaraki, JP;
Toyofusa Yoshimura, Ibaraki, JP;
Haruo Suzuki, Katsuta, JP;
Tomio Yoshida, Takahagi, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
A printed circuit board comprising an insulating board deposited with a catalyst having reactivity against electroless plating deposition, a resist for electroless plating provided on the insulating board excepting the part where a circuit is to be formed and a circuit formed by electroless plating, wherein the resist for electroless plating contains a coupling agent having a function of preventing the catalyst from ionizing. A process for producing the printed circuit board in which the insulating board surface excepting the part where a circuit is to be formed is covered with a resist for electroless plating containing a coupling agent having a function of preventing the catalyst from ionizing. Use of said resist for electroless plating can prevent drop of insulation resistance of the insulating board after moisture absorption.