Tokyo, Japan

Makio Tokoh


 

Average Co-Inventor Count = 3.2

ph-index = 2

Forward Citations = 51(Granted Patents)


Location History:

  • Kurashiki, JP (1993 - 2011)
  • Tokyo, JP (2011 - 2016)

Company Filing History:


Years Active: 1993-2016

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5 patents (USPTO):Explore Patents

Title: Makio Tokoh: Innovator in Polyvinyl Acetal Resin Technology

Introduction

Makio Tokoh is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of materials science, particularly in the development of polyvinyl acetal resin films. With a total of five patents to his name, Tokoh's work has had a substantial impact on various applications, including laminated glass and solar cell modules.

Latest Patents

Among his latest patents, Tokoh has developed a polyvinyl acetal resin film designed to be used as a layer in multilayer structure articles. This invention aims to prevent the intrusion of bubbles and the generation of unfilled portions at the edges of the film. The film features a thickness distribution of 10% or less and a volatile matter content of 1.0 mass % or less. Additionally, he has created a vinyl alcohol-based polymer that is soluble in water and exhibits high viscosity, along with a film that maintains its tensile elastic modulus even in high humidity conditions.

Career Highlights

Tokoh is currently employed at Kuraray Co., Ltd., a leading company in the field of advanced materials. His innovative work has positioned him as a key figure in the development of new materials that enhance product performance and reliability.

Collaborations

Throughout his career, Tokoh has collaborated with notable colleagues, including Satoshi Hirofuji and Hidemasa Oda. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Makio Tokoh's contributions to the field of polyvinyl acetal resin technology exemplify the importance of innovation in material science. His patents not only advance the industry but also pave the way for future developments in various applications.

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