This inventor holds 1 USPTO granted patent. Top assignee: Sekisui Chemical Co., Ltd.. Active years: 2018.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2018
Title: Mai Nagata: Innovator in Semiconductor Technology
Introduction
Mai Nagata is a prominent inventor based in Osaka, Japan. She has made significant contributions to the field of semiconductor technology. Her innovative work focuses on enhancing the efficiency and reliability of semiconductor chip stacking.
Latest Patents
Mai Nagata holds a patent for an "Adhesive film for semiconductor chip with through electrode." This adhesive film is designed for stacking multiple semiconductor chips, each equipped with a through electrode, on a semiconductor wafer. The invention allows for favorable connections between the through electrodes while minimizing the formation of voids. Additionally, it reduces the length of burrs that protrude around the semiconductor chips. The adhesive film features a minimum melt viscosity of 50 to 2500 Pa·s and a thixotropic index at 140°C of 8 or lower.
Career Highlights
Mai Nagata is currently employed at Sekisui Chemical Co., Ltd., where she continues to develop innovative solutions in semiconductor technology. Her work has garnered attention for its practical applications and potential to improve manufacturing processes.
Collaborations
Mai has collaborated with notable colleagues, including Toshio Enami and Kohei Takeda. These partnerships have contributed to her success and the advancement of her projects.
Conclusion
Mai Nagata is a trailblazer in the semiconductor industry, with her patent showcasing her innovative spirit and technical expertise. Her contributions are paving the way for advancements in semiconductor technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile