The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 20, 2018
Filed:
Mar. 25, 2015
Applicant:
Sekisui Chemical Co., Ltd., Osaka, JP;
Inventors:
Assignee:
SEKISUI CHEMICAL CO., LTD., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 1/20 (2006.01); C09J 163/00 (2006.01); H01L 25/00 (2006.01); H01L 21/52 (2006.01); C01B 33/18 (2006.01); C09C 1/30 (2006.01); C09J 133/00 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); C08G 59/42 (2006.01); C08G 59/50 (2006.01); C08L 33/06 (2006.01); C09J 7/10 (2018.01); C08K 3/36 (2006.01); C08K 3/013 (2018.01);
U.S. Cl.
CPC ...
C09J 163/00 (2013.01); C01B 33/18 (2013.01); C08G 59/42 (2013.01); C08G 59/5073 (2013.01); C08L 33/06 (2013.01); C09C 1/30 (2013.01); C09J 7/10 (2018.01); C09J 133/00 (2013.01); H01B 1/20 (2013.01); H01L 21/52 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); H01L 24/97 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); C01P 2004/32 (2013.01); C01P 2004/62 (2013.01); C01P 2004/64 (2013.01); C08K 3/013 (2018.01); C08K 3/36 (2013.01); C08K 2201/014 (2013.01); C09J 2203/326 (2013.01); C09J 2205/102 (2013.01); C09J 2433/00 (2013.01); C09J 2463/00 (2013.01); H01L 24/13 (2013.01); H01L 24/32 (2013.01); H01L 2224/16146 (2013.01); H01L 2224/271 (2013.01); H01L 2224/29006 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29387 (2013.01); H01L 2224/29388 (2013.01); H01L 2224/29393 (2013.01); H01L 2224/29499 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/81907 (2013.01); H01L 2224/83101 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/83862 (2013.01); H01L 2224/83907 (2013.01); H01L 2224/83948 (2013.01); H01L 2224/9211 (2013.01); H01L 2224/97 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06541 (2013.01);
Abstract
An adhesive film for a semiconductor chip with a through electrode, which is used for stacking multiple semiconductor chips each with a through electrode on a semiconductor wafer, which can favorably connect the through electrodes while suppressing formation of voids, and which can reduce the length of burrs protruding around the semiconductor chips. An adhesive film for a semiconductor chip with a through electrode, to be used for stacking multiple semiconductor chips each with a through electrode on a semiconductor wafer, the adhesive film having a minimum melt viscosity of 50 to 2500 Pa·s and a thixotropic index at 140° C. of 8 or lower.