Tokyo, Japan

Mai Isomoto

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Hitachi High-Tech Corporation. Active years: 2025.

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Mai Isomoto: Innovator in Plasma Processing Technology

Introduction

Mai Isomoto is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of plasma processing, particularly in the area of hard mask etching. His innovative approach aims to enhance the efficiency and effectiveness of plasma processing methods.

Latest Patents

Mai Isomoto holds a patent for a plasma processing method designed to prevent the generation of deposition from an underlying metal film. This method achieves an anisotropic shape in hard mask etching. The process involves a two-step etching technique using a plasma generated from a mixed gas containing O2, CHF3, NF3, Ar, and He. The first step utilizes pulse-modulated radio frequency power, while the second step employs continuous wave (CW) radio frequency power, ensuring optimal results in etching TEOS and silicon nitride films.

Career Highlights

Isomoto is currently associated with Hitachi High-Tech Corporation, where he continues to develop and refine his innovative plasma processing techniques. His work has garnered attention for its potential applications in various industries, including semiconductor manufacturing.

Collaborations

Mai Isomoto collaborates with notable colleagues such as Hitoshi Kobayashi and Ryota Takahashi. Their combined expertise contributes to advancing research and development in plasma processing technologies.

Conclusion

Mai Isomoto's contributions to plasma processing technology exemplify the impact of innovative thinking in the field. His patent and ongoing work at Hitachi High-Tech Corporation highlight the importance of advancements in manufacturing processes.

Profile summary based on public USPTO records.
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