Company Filing History:
Years Active: 2014
Title: Innovations by Madhukumar Janardhanan Pillai
Introduction
Madhukumar Janardhanan Pillai is an accomplished inventor based in Singapore, SG. He has made significant contributions to the field of technology, particularly in the area of wire bonding. His innovative approach has led to the development of a unique patent that enhances the efficiency of bonding processes in electronic components.
Latest Patents
Madhukumar holds a patent titled "Bond pad assessment for wire bonding." This invention involves selecting suitable bonding parameters for forming wire bonds onto bond pads of a substrate. The process includes making one or more indentations onto at least one bond pad using an indentation tool. By applying a series of predetermined forces, a depth-force profile of the substrate is measured. This profile establishes a relationship between each force applied and the resultant depth of the indentation. Ultimately, an appropriate set of bonding parameters is determined based on the measured depth-force profile. Madhukumar's patent represents a significant advancement in the field of wire bonding technology, with 1 patent to his name.
Career Highlights
Madhukumar is currently employed at Asm Technology Singapore Pte Ltd, where he continues to innovate and contribute to the field. His work focuses on improving bonding techniques, which are crucial for the reliability and performance of electronic devices. His expertise and dedication have made him a valuable asset to his company.
Collaborations
Madhukumar has collaborated with talented coworkers, including Ming Li and Dewen Tian. Their combined efforts in research and development have fostered a creative environment that encourages innovation and problem-solving.
Conclusion
Madhukumar Janardhanan Pillai is a notable inventor whose work in wire bonding technology has made a significant impact in the industry. His patent and ongoing contributions at Asm Technology Singapore Pte Ltd highlight his commitment to advancing technology.