Company Filing History:
Years Active: 2003-2005
Title: M Tekamul Buber: Innovator in RF Technology
Introduction
M Tekamul Buber is a notable inventor based in Nashua, NH (US), recognized for his contributions to radio frequency (RF) technology. He holds 2 patents that showcase his expertise in developing advanced electronic packaging solutions.
Latest Patents
One of his latest patents is for an RF transition for an area array package. This invention involves a laminate multilayer ball-grid-array package that is suitable for millimeter-wave circuits. The frequency bandwidth of the package ranges from DC to 40 GHz. The design utilizes laminate circuit board materials to ensure that the temperature expansion coefficients of the package align with those of the host PCB. Electrical connections between the package and the host PCB are achieved using ball-grid-array technology. Additionally, the package can be sealed, covered, or encapsulated, making it suitable for high-volume production. Another significant patent is for a wide bandwidth bias tee. This device includes a high-frequency terminal, a first resistor coupled between the high-frequency terminal and a capacitor, and a second resistor that is coupled in series with the first resistor. The low-frequency terminal is connected to the second resistor, enhancing the device's functionality.
Career Highlights
Throughout his career, M Tekamul Buber has worked with several prominent companies, including Mia-com, Inc. and M/A-COM Corporation. His experience in these organizations has contributed to his innovative approach to RF technology.
Collaborations
M Tekamul Buber has collaborated with notable professionals in the field, including Noyan Kinayman and Bernard A. Ziegner. These collaborations have further enriched his work and expanded his impact on the industry.
Conclusion
M Tekamul Buber's contributions to RF technology through his patents and collaborations highlight his role as an influential inventor in the field. His work continues to shape advancements in electronic packaging solutions.