The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 10, 2005
Filed:
Feb. 14, 2002
Noyan Kinayman, Malden, MA (US);
Bernard A. Ziegner, Tyngsborough, MA (US);
Richard Anderson, N. Attleborough, MA (US);
Jean-pierre Lanteri, Waltham, MA (US);
M. Tekamul Buber, Nashua, NH (US);
Noyan Kinayman, Malden, MA (US);
Bernard A. Ziegner, Tyngsborough, MA (US);
Richard Anderson, N. Attleborough, MA (US);
Jean-Pierre Lanteri, Waltham, MA (US);
M. Tekamul Buber, Nashua, NH (US);
MIA-com, Lowell, MA (US);
Abstract
A laminate multilayer ball-grid-array package is suitable for millimeter-wave circuits. The frequency bandwidth of the package is DC to 40 GHz. The package is made using laminate circuit board materials to match the temperature expansion coefficients of the package to the host PCB. Electrical connection between the package and the host PCB on which the package is mounted is achieved using ball-grid-array technology. The package can be sealed, covered, or encapsulated, and is suitable for high-volume production.