Company Filing History:
Years Active: 2005
Title: Bernard A. Ziegner: Innovator in RF Transition Technology
Introduction
Bernard A. Ziegner is a notable inventor based in Tyngsborough, MA (US). He has made significant contributions to the field of millimeter-wave circuits through his innovative designs and patents. His work focuses on enhancing the performance and efficiency of electronic packaging.
Latest Patents
Ziegner holds a patent for an RF transition for an area array package. This laminate multilayer ball-grid-array package is specifically designed for millimeter-wave circuits, with a frequency bandwidth ranging from DC to 40 GHz. The package utilizes laminate circuit board materials that align the temperature expansion coefficients of the package with those of the host PCB. Electrical connections between the package and the host PCB are established using ball-grid-array technology. Additionally, the package can be sealed, covered, or encapsulated, making it suitable for high-volume production.
Career Highlights
Throughout his career, Ziegner has demonstrated a commitment to advancing technology in the electronics sector. His innovative approach has led to the development of solutions that address the challenges faced in high-frequency applications. His work is recognized for its practical applications and contributions to the industry.
Collaborations
Ziegner has collaborated with notable professionals in his field, including Noyan Kinayman and Richard Alan Anderson. These collaborations have further enriched his work and expanded the impact of his innovations.
Conclusion
Bernard A. Ziegner's contributions to RF transition technology exemplify his dedication to innovation in the electronics industry. His patent for a laminate multilayer ball-grid-array package showcases his ability to address complex challenges in millimeter-wave circuits. Ziegner's work continues to influence the development of advanced electronic packaging solutions.