M/a -Com, Inc.

Mia-Com, Inc.

M Tekamul Buber

Robert Ian Gresham

Noyan Kinayman

Richard Alan Anderson

Jean-Pierre Lanteri

Adil Khalil

Bernard A Ziegner

A laminate multilayer ball-grid-array package is suitable for millimeter-wave circuits. The frequency bandwidth of the package is DC to 40 GHz. The package is made using laminate circuit board materials to match the temperature expansion coefficients of the package to the host PCB. Electrical connection between the package and the host PCB on which the package is mounted is achieved using ball-grid-array technology. The package can be sealed, covered, or encapsulated, and is suitable for high-volume production.

RF transition for an area array package

A wide bandwidth bias tee including a high frequency terminal, a first resistor coupled between the high frequency terminal and a capacitor, a second resistor coupled to the capacitor, the second resistor coupled in series with the first resistor, and a low frequency terminal, the low frequency terminal coupled to the second resistor.

Wide bandwidth bias tee

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Nashua, NH, United States of America

M Tekamul Buber