Sheboygan, WI, United States of America

Lyle D Robison

This inventor holds 1 USPTO granted patent. Top assignee: Bemis Company, Inc.. Active years: 1994.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Lyle D Robison. Retrieved from https://idiyas.com/inventor/lyle-d-robison

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 29(Granted Patents)


Company Filing History:


Years Active: 1994

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Lyle D. Robison

Introduction

Lyle D. Robison is a notable inventor based in Sheboygan, Wisconsin. He has made significant contributions to the field of packaging technology. His innovative approach has led to the development of a unique flexible pouch package designed for fluid products.

Latest Patents

Lyle D. Robison holds a patent for a "Flexible package with an easy open arrangement." This invention features a composite bag with inner and outer package walls made of flexible film. The design includes a chamber defined by the sealed edges of the film, allowing for an easy open feature that enhances user convenience.

Career Highlights

Robison is associated with Bemis Company, Inc., where he has applied his expertise in packaging solutions. His work has contributed to advancements in the industry, particularly in creating user-friendly packaging options.

Collaborations

One of his notable coworkers is Robert C. James, with whom he has likely collaborated on various projects within the company.

Conclusion

Lyle D. Robison's innovative spirit and dedication to improving packaging technology have made a lasting impact in the field. His patent for a flexible package demonstrates his commitment to enhancing consumer convenience and product accessibility.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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