Scharnstein, Austria

Lukas Heupl

This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignees: Polymer Competence Center Leoben Gmbh, Tdk Electronics Ag. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Lukas Heupl. Retrieved from https://idiyas.com/inventor/lukas-heupl

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile



Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Lukas Heupl: Inventor in Capacitor Dielectric Technology

Introduction

Lukas Heupl is an inventor based in Scharnstein, Austria. His patent work concerns methods for producing polymer-based dielectrics and capacitors.

Latest Patents

Heupl is associated with 1 patent, titled “Process of Manufacturing a Dielectric for a Capacitor and Process of Manufacturing a Capacitor and Capacitor.” The invention describes polymerizing monomers to form polymer chains with reactive groups branching from selected repeating units. Linker molecules, each with at least two chemical linking points, react with those groups to create covalent bonds and crosslink the polymer chains. The disclosed processes apply this crosslinked material to producing a capacitor dielectric and a capacitor.

Career Highlights

Heupl’s professional affiliations include TDK Electronics AG and Polymer Competence Center Leoben GmbH. His patent reflects work at the intersection of polymer chemistry and capacitor technology.

Collaborations

His named coworkers include Birgit Six and Stefan Sax.

Conclusion

Lukas Heupl’s patent focuses on using linker molecules to crosslink functionalized polymer chains for capacitor dielectrics, connecting polymer science with electronic component manufacturing.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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