Luis Carlos Alvarez Mata

Title: Luis Carlos Alvarez Mata and Memory-on-Package Innovation.

Introduction

Luis Carlos Alvarez Mata is an inventor associated with Cartago, Costa Rica, and Intel Corporation. His patent work describes a memory-on-package design intended to connect processors with memory modules while reducing package height.

Latest Patents

The provided information identifies one patent for Alvarez Mata: “Memory on Package (MOP) Apparatus with Reverse CAMM (Compression Attached Memory Module) and Compression Mount Technology (CMT) Connector(s).” The design places one or more CPUs, SoCs, or XPUs on a first MOP substrate and couples them to one or more CAMMs through CMT connectors. The CAMMs carry memory chips or packages, such as LPDDR or DDR SDRAM, on the underside of their substrates using signal-coupling methods such as a ball grid array. Inverting the CAMM places the memory components downward, helping reduce the MOP’s Z-height. The described configuration may also use two CAMMs, each connected to the MOP substrate through a respective CMT connector.

Career Highlights

Alvarez Mata’s listed patent reflects work on packaging and interconnection technologies for processor and memory systems. The invention focuses on integrating memory modules with computing components in a compact package.

Collaborations

The supplied information lists George Vergis as a coworker. It does not specify his role in the patent or the nature of their collaboration.

Conclusion

Luis Carlos Alvarez Mata’s identified patent presents a compact memory-on-package architecture that uses reverse-oriented CAMMs and CMT connectors to connect memory with processors while reducing package height.