This inventor holds 1 USPTO granted patent. Top assignee: Micron Technology Incorporated. Active years: 2010.
Company Filing History:
Years Active: 2010
Title: Low Slu Waf: Innovator in Circuit Packaging Technology
Introduction
Low Slu Waf is a notable inventor based in Singapore, SG. He has made significant contributions to the field of circuit packaging technology. With a focus on innovative methods, he has developed solutions that enhance the efficiency and functionality of electronic components.
Latest Patents
Low Slu Waf holds 1 patent for his invention titled "Apparatus and method for packaging circuits." This patent describes methods for forming an edge contact on a die and edge contact structures. The edge contacts on the die are designed not to increase the height of the die. They are strategically positioned on the periphery of the die and within the saw streets. Each edge contact connects to one bond pad of each die adjacent to the saw street. When the dies are separated, the edge contact is divided into contacts for each adjacent die. In one embodiment, a recess is formed in the saw street, which is created by scribing the saw street with a mechanical cutter. The recess is then patterned, and contact material is deposited to form the edge contacts.
Career Highlights
Low Slu Waf is currently employed at Micron Technology Incorporated, where he continues to innovate in the field of circuit packaging. His work has been instrumental in advancing the technology used in electronic devices.
Collaborations
He collaborates with talented coworkers, including Chan Min Yu and Boon Suan Jeung, who contribute to the innovative environment at Micron Technology.
Conclusion
Low Slu Waf's contributions to circuit packaging technology exemplify the impact of innovative thinking in the electronics industry. His patent reflects a commitment to enhancing the design and functionality of electronic components.