Austin, MN, United States of America

LouJean Reid

This inventor holds 1 USPTO granted patent. Top assignee: Hormel Foods Corporation. Active years: 2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: LouJean Reid. Retrieved from https://idiyas.com/inventor/loujean-reid

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:


Years Active: 2014

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1 patent (USPTO):Explore Patents

Title: LouJean Reid: Innovator in Thermal Forming Technology

Introduction

LouJean Reid is a notable inventor based in Austin, MN (US). She has made significant contributions to the field of thermal forming technology. With a focus on innovation, Reid has developed a unique solution that enhances the efficiency of thermal die assemblies.

Latest Patents

Reid holds a patent for an "Adjustable Thermal Forming Die Assembly." This invention features a thermal forming die that includes at least one die cavity of a select shape. The die is designed with openings that align with inserts, which have internal passages conforming to the shape of the openings. This innovative design allows for the selective adjustment of the depth of the forming cavity, thereby improving the versatility and functionality of the thermal forming assembly.

Career Highlights

LouJean Reid is currently employed at Hormel Foods Corporation, where she applies her expertise in thermal forming technology. Her work has been instrumental in advancing the company's capabilities in manufacturing processes. Reid's dedication to innovation has positioned her as a key player in her field.

Collaborations

Throughout her career, Reid has collaborated with talented individuals such as Daniel S. Miller and Steven E. Sampson. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

LouJean Reid's contributions to thermal forming technology exemplify her commitment to innovation and excellence. Her patent for the adjustable thermal forming die assembly showcases her ability to solve complex engineering challenges. Reid's work continues to influence the industry and inspire future inventors.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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