The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 30, 2014
Filed:
May. 12, 2011
Daniel S. Miller, Austin, MN (US);
Steven E. Sampson, Saint Ansgar, IA (US);
Loujean Reid, Austin, MN (US);
Frank D. Fryer, Lyle, MN (US);
Danny K. Petersen, Albert Lea, MN (US);
Kurt A. Lindsey, Austin, MN (US);
Daniel S. Miller, Austin, MN (US);
Steven E. Sampson, Saint Ansgar, IA (US);
LouJean Reid, Austin, MN (US);
Frank D. Fryer, Lyle, MN (US);
Danny K. Petersen, Albert Lea, MN (US);
Kurt A. Lindsey, Austin, MN (US);
Hormel Foods Corporation, Austin, MN (US);
Abstract
An adjustable thermal die assembly is provided. The thermal die assembly includes a thermal forming die and at least one insert. The thermal forming die has at least one die cavity of a select shape. The die further has at least one opening to the at least one die cavity. The at least one insert has at least one internal passage that is conformed to have a shape of the at least one opening to the at least one die cavity of the die. Moreover, the at least one insert is configured and arranged to be selectively coupled to the die with the at least one internal passage of the at least one insert aligning with the at least one opening of the at least one die cavity to selectively increase a depth of a forming cavity of the thermal forming assembly.