Hopewell Junction, NY, United States of America

Louis V Medina


Average Co-Inventor Count = 5.7

ph-index = 1

Forward Citations = 13(Granted Patents)


Location History:

  • New Windsor, NY (US) (2010)
  • Hopewell Junction, NY (US) (2015 - 2017)

Company Filing History:


Years Active: 2010-2017

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4 patents (USPTO):Explore Patents

Title: Innovations by Louis V Medina

Introduction

Louis V Medina is a notable inventor based in Hopewell Junction, NY (US). He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work primarily focuses on enhancing the efficiency and effectiveness of semiconductor wafer probing systems.

Latest Patents

Among his latest patents is a "Semiconductor wafer probing system including pressure sensing and control unit." This innovative system features a probe card assembly with multiple individual probe structures designed to make contact with a semiconductor wafer mounted on a motor-driven wafer chuck. Each probe structure is equipped with an integrated pressure sensing unit, and a controller drives the probe card assembly using piezoelectric driver units that respond to feedback from the pressure sensing units. Another significant patent is "Pressure sensing and control for semiconductor wafer probing," which shares similar features and aims to improve the probing process for semiconductor wafers.

Career Highlights

Louis V Medina is currently employed at International Business Machines Corporation (IBM), where he continues to develop cutting-edge technologies in semiconductor probing. His expertise and innovative mindset have positioned him as a valuable asset in the tech industry.

Collaborations

He has collaborated with esteemed colleagues such as Tso-Hui Ting and Ping-Chuan Wang, contributing to advancements in their shared field of expertise.

Conclusion

Louis V Medina's contributions to semiconductor technology through his patents and work at IBM highlight his role as a leading inventor in the industry. His innovative approaches continue to shape the future of semiconductor probing systems.

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