Loon Kwang Tan

Title: Innovations by Loon Kwang Tan

Introduction

Loon Kwang Tan is a notable inventor based in Kepala Batas, Malaysia. He has made significant contributions to the field of integrated circuit packaging, holding a total of 7 patents. His work has advanced the technology used in electronic devices, making them more efficient and reliable.

Latest Patents

Loon Kwang Tan's latest patents include innovative methods for packaging integrated circuits. One of his patents describes techniques for packaging an integrated circuit that involve attaching a die to a conductive layer before forming dielectric layers on the opposing surface of the conductive layer. This process allows for the removal of the carrier substrate before the dielectric layers are formed, ultimately leading to a coreless package substrate for the integrated circuit package. Another significant patent focuses on an integrated circuit package with a solderless interconnection structure. This design includes an integrated circuit die and a package substrate with a conductive pad, where a conductive pillar directly contacts the conductive pad. This innovative approach enhances the alignment and connectivity of integrated circuit components.

Career Highlights

Loon Kwang Tan is currently associated with Altera Corporation, where he continues to develop cutting-edge technologies in the field of electronics. His expertise in integrated circuit packaging has positioned him as a key player in the industry.

Collaborations

Throughout his career, Loon Kwang Tan has collaborated with talented individuals such as Teik Tiong Toong and Ping Chet Tan. These collaborations have fostered innovation and contributed to the advancement of technology in their field.

Conclusion

Loon Kwang Tan's contributions to integrated circuit packaging demonstrate his commitment to innovation and excellence in technology. His patents reflect a deep understanding of the complexities involved in electronic design, making him a valuable asset to the industry.