Taipei, Taiwan

Long Song Lin

This inventor holds 2 USPTO granted patents and 4 published patent applications. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2024-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Long Song Lin. Retrieved from https://idiyas.com/inventor/long-song-lin

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 2 

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2024-2025

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2 patents (USPTO):Explore Patents

Title: Long Song Lin: Innovator in Semiconductor Technology

Introduction

Long Song Lin is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of semiconductor technology, holding two patents that showcase his innovative approach to engineering.

Latest Patents

One of his latest patents is titled "Thermoelectric cooling of semiconductor devices." This patent describes an integrated circuit (IC) device that includes a chip with a semiconductor substrate and a thermoelectric module embedded within it. The thermoelectric module consists of a first semiconductor structure electrically connected to a second semiconductor structure, with a bottom portion extending through the thickness of the semiconductor substrate. Notably, the first and second semiconductor structures contain dopants of different conductivity types.

Another significant patent is the "Hybrid node chiplet stacking design." This patent focuses on methods for generating multichip, hybrid node stacked package designs from single chip designs using artificial intelligence techniques, such as machine learning. The disclosed methods facilitate heterogeneous integration using advanced packaging technologies, enhance design for manufacturability of single chip designs, and reduce manufacturing costs and system sizes. An exemplary method involves receiving a single chip design and generating a multichip, hybrid node design by disassembling the single chip design into chiplets with different functions and integrating them into a stacked chip package structure.

Career Highlights

Long Song Lin is currently employed at Taiwan Semiconductor Manufacturing Company Limited, where he continues to push the boundaries of semiconductor innovation. His work has been instrumental in advancing the capabilities of integrated circuits and packaging technologies.

Collaborations

He collaborates with notable colleagues, including Jen-Yuan Chang and Jheng-Hong Jiang, who contribute to his projects and research endeavors.

Conclusion

Long Song Lin's contributions to semiconductor technology through his innovative patents and collaborative efforts highlight his role as a key figure in the industry. His work continues to influence the future of semiconductor design and manufacturing.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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