This inventor holds 1 USPTO granted patent. Top assignee: Freescale Semiconductor,inc.. Active years: 2017.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2017
Title: Logendran Bharatham: Innovator in Package-on-Package Technology
Introduction
Logendran Bharatham is a notable inventor based in Seremban, Malaysia. He has made significant contributions to the field of semiconductor technology, particularly in the development of innovative packaging solutions.
Latest Patents
Bharatham holds a patent for a "Heat spreader for package-on-package (PoP) type packages." This invention involves a PoP device that includes a first package and an interposer heat spreader. The first package consists of a die and a substrate, which features die contact pads, top contact pads, bottom contact pads, and interconnects. The die is electrically connected to the die contact pads, while the top contact pads are designed to connect with a second package to form the PoP device. The heat spreader is thermally connected to the die and includes at least one arm extending beyond the first package's edge, along with openings for electrical interconnects.
Career Highlights
Logendran Bharatham is currently employed at Freescale Semiconductor, Inc., where he continues to advance his work in semiconductor technologies. His innovative approach has led to the development of solutions that enhance the efficiency and performance of electronic devices.
Conclusion
Logendran Bharatham's contributions to the field of semiconductor packaging, particularly through his patented technology, highlight his role as an influential inventor. His work at Freescale Semiconductor, Inc. continues to impact the industry positively.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile