The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 06, 2017
Filed:
Aug. 25, 2015
Freescale Semiconductor, Inc., Austin, TX (US);
Logendran Bharatham, Seremban, MY;
FREESCALE SEMICONDUCTOR,INC., Austin, TX (US);
Abstract
A package-on-package (PoP) device has a first package and an interposer heat spreader. The first package includes a die and a substrate. The substrate has die contact pads, top contact pads, bottom contact pads, and interconnects between the die contact pads, the top contact pads, and the bottom contact pads. The die is electrically connected to the die contact pads. The top contact pads are adapted to be electrically connected to a second package to form the PoP device. The heat spreader has a central section thermo-conductively connected to the die. The heat spreader includes at least one arm connected to the central section and extending out past an edge of the first package. The heat spreader also has openings for electrical interconnects between the first package and the second package.