This inventor holds 1 USPTO granted patent. Top assignee: Intel Corporation. Active years: 2007.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2007
Title: Innovations by Lisa Yung Hui Lee
Introduction
Lisa Yung Hui Lee is an accomplished inventor based in Sarawak, Malaysia. She has made significant contributions to the field of packaging technology. Her innovative approach has led to the development of a unique method for controlling package warpage.
Latest Patents
Lisa holds 1 patent for her invention titled "Package Warpage Control." This method involves placing a restrainer on a package during processing. The process includes clipping the restrainer in place and exposing the package to high temperatures. After processing, the restrainer is removed. An alternative process involves attaching a component die to a substrate with a cavity on its first surface. This method may also include dispensing and curing an underfill material in the cavity, followed by attaching a lid to the first surface of the substrate.
Career Highlights
Lisa is currently employed at Intel Corporation, where she continues to innovate and contribute to advancements in packaging technology. Her work has garnered attention for its practical applications in the industry.
Collaborations
Some of her notable coworkers include Hooi Jin Teng and Soon Chuan Ong, who collaborate with her on various projects at Intel Corporation.
Conclusion
Lisa Yung Hui Lee's contributions to packaging technology exemplify the spirit of innovation. Her patent for package warpage control showcases her ability to solve complex problems in the industry.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile