Mechanicville, NY, United States of America

Lisa J Loparco

This inventor holds 1 USPTO granted patent. Top assignee: Rensselaer Polytechnic Institute. Active years: 2005.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Lisa J Loparco. Retrieved from https://idiyas.com/inventor/lisa-j-loparco

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2005

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1 patent (USPTO):Explore Patents

Title: The Innovations of Lisa J Loparco

Introduction

Lisa J Loparco is a notable inventor based in Mechanicville, NY (US). She has made significant contributions to the field of integrated circuit technology. Her work primarily focuses on improving methods for polishing metal features on integrated circuits.

Latest Patents

Lisa holds a patent for her invention titled "Electrochemical planarization of metal feature surfaces." This innovative method enhances the polishing process of integrated circuits by utilizing electropolishing techniques. One of the key advantages of her approach is that it effectively polishes metal features without damaging the softer insulating materials of the integrated circuit.

Career Highlights

Lisa is affiliated with Rensselaer Polytechnic Institute, where she continues to advance her research and development efforts. Her dedication to innovation in the field of electronics has positioned her as a valuable contributor to the industry.

Collaborations

Lisa has worked alongside her coworker, David J Duquette, to further enhance the impact of her research and inventions.

Conclusion

Lisa J Loparco's contributions to the field of integrated circuits through her innovative patent demonstrate her commitment to advancing technology. Her work not only improves manufacturing processes but also sets a foundation for future innovations in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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