Chengdu, China

Liping Dai

This inventor holds 1 USPTO granted patent. Top assignee: University of Electronic Science and Technology of China. Active years: 2021.


% Patents Active = 100.0

Average Co-Inventor Count = 16.0

ph-index = 1


Company Filing History:


Years Active: 2021

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1 patent (USPTO):Explore Patents

Title: Liping Dai: Innovator in Two-Dimensional Nanosheets

Introduction

Liping Dai is a prominent inventor based in Chengdu, China. He is known for his significant contributions to the field of nanotechnology, particularly in the preparation of ultrathin two-dimensional nanosheets. His innovative methods have the potential to impact various applications in materials science and electronics.

Latest Patents

Liping Dai holds a patent titled "Method for preparing ultrathin two-dimensional nanosheets and applications thereof." This patent describes a method for creating ultrathin two-dimensional (2D) monocrystalline nanosheets. The process involves placing BiX powder, where X can be I, Br, or Cl, in a crucible and utilizing a specialized heating method to facilitate the chemical reaction necessary for nanosheet production. The method includes vacuumizing a quartz tube, pumping in argon gas, and maintaining specific temperature zones to ensure the successful formation of the nanosheets.

Career Highlights

Liping Dai is affiliated with the University of Electronic Science and Technology of China. His work at this institution has allowed him to explore advanced materials and their applications in technology. His research has garnered attention for its innovative approach and practical implications.

Collaborations

Liping Dai has collaborated with notable colleagues, including Yuqing Liu and Xianfu Wang. These partnerships have contributed to the advancement of research in nanotechnology and materials science.

Conclusion

Liping Dai's work in the field of ultrathin two-dimensional nanosheets exemplifies the innovative spirit of modern science. His contributions continue to pave the way for advancements in technology and materials.

Profile summary based on public USPTO records.
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