Xi'an, China

Lingyao Meng

This inventor holds 1 USPTO granted patent. Top assignee: Xidian University. Active years: 2026.


Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Lingyao Meng: Innovator in CMOS Technology

Introduction

Lingyao Meng is a prominent inventor based in Xi'an, China. He has made significant contributions to the field of semiconductor technology, particularly in the development of CMOS structures. His innovative work focuses on enhancing the performance and reliability of integrated circuits.

Latest Patents

Lingyao Meng holds a patent for a CMOS structure and fabrication methods of FinFET CMOS, FD CMOS, and GAA CMOS. This patent outlines a CMOS structure that includes both nMOS and pMOS components. The nMOS features a first channel region and a first gate electrode formed on a semiconductor substrate, while the pMOS includes a second channel region and a second gate electrode. Notably, both channel regions are made from semiconductor materials with the same conductivity type, and the gate electrodes are formed from conductive materials with the same work function. This innovative CMOS structure reduces the processing steps required for fabrication, thereby decreasing process complexity and production costs. This advancement is beneficial for improving the performance and reliability of CMOS and its integrated circuits.

Career Highlights

Lingyao Meng is affiliated with Xidian University, where he continues to engage in research and development in semiconductor technologies. His work has garnered attention for its practical applications in the industry.

Collaborations

He has collaborated with notable colleagues, including Huiyong Hu and Liming Wang, contributing to various projects in the field of semiconductor research.

Conclusion

Lingyao Meng's contributions to CMOS technology exemplify the impact of innovative thinking in the semiconductor industry. His work not only advances technology but also enhances the efficiency and cost-effectiveness of integrated circuits.

Profile summary based on public USPTO records.
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