Singapore, Singapore

Lin Yih Shung

This inventor holds 1 USPTO granted patent. Top assignee: Aac Technologies Pte. Ltd.. Active years: 2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Lin Yih Shung. Retrieved from https://idiyas.com/inventor/lin-yih-shung

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:


Years Active: 2017

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1 patent (USPTO):Explore Patents

Title: Lin Yih Shung: Innovator in Microphone Chip Technology

Introduction

Lin Yih Shung is a notable inventor based in Singapore, recognized for his contributions to the field of microphone technology. He has developed a unique method for manufacturing microphone chips, which has garnered attention in the industry. His innovative approach reflects a commitment to advancing audio technology.

Latest Patents

Lin Yih Shung holds a patent for a method of manufacturing a microphone chip. This method includes several intricate steps, such as providing a first underlay, depositing insulating oxide layers, and etching various layers to create the final microphone chip. The process culminates in the combination of the first and second underlays, resulting in a functional microphone chip.

Career Highlights

Lin is currently employed at AAC Technologies Pte. Ltd., where he continues to push the boundaries of microphone technology. His work at AAC Technologies has positioned him as a key player in the development of advanced audio components.

Collaborations

Lin collaborates with talented coworkers, including Tan Qiu Yu Veronica and Goh Wan Ling Serene. Their combined expertise fosters an environment of innovation and creativity within the company.

Conclusion

Lin Yih Shung's contributions to microphone chip technology exemplify the spirit of innovation. His patent and work at AAC Technologies highlight his role as a significant inventor in the audio industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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