The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 13, 2017
Filed:
Oct. 19, 2016
Goh Wan Ling Serene, Singapore, SG;
Loo LI Eng, Singapore, SG;
Tan Qiu Yu Veronica, Singapore, SG;
Xiaohui Zhong, Singapore, SG;
Lin Yih Shung, Singapore, SG;
Lai Kah Keen, Singapore, SG;
Goh Wan Ling Serene, Singapore, SG;
Loo Li Eng, Singapore, SG;
Tan Qiu Yu Veronica, Singapore, SG;
Xiaohui Zhong, Singapore, SG;
Lin Yih Shung, Singapore, SG;
Lai Kah Keen, Singapore, SG;
AAC TECHNOLOGIES PTE. LTD., Singapore, SG;
Abstract
A method for manufacturing a microphone chip, includes steps of: providing a first underlay, and depositing insulating oxide layers at both sides; depositing the component layers on the insulating oxide layers respectively; depositing the tetraethyl orthosilicate oxide layers on the component layers; etching the tetraethyl orthosilicate oxide layers; patterning various deposition layers in the first underlay; providing the second underlay; depositing the oxide layers on the substrate; etching and patterning oxide layer; releasing the back plate; combining the first underlay and the second underlay by welding the tetraethyl orthosilicate oxide layer on the first underlay and the oxide layer on the second underlay under ambient temperature; etching the second underlay to form the back cavity; etching the first underlay to release the diaphragm and obtaining the microphone chip.