Lin-Kun Ding

Title: Lin-Kun Ding: Innovator in Circuit Board Technology

Introduction

Lin-Kun Ding is a prominent inventor based in Shenzhen, China. He has made significant contributions to the field of circuit board technology, holding a total of 12 patents. His innovative approaches have paved the way for advancements in electronic device manufacturing.

Latest Patents

One of Lin-Kun Ding's latest patents is a method for manufacturing circuit boards using electrically conductive particles. This exemplary method involves obtaining an insulating substrate, liquid heat-curable adhesive, and electrically conductive particles. The particles are added to the adhesive and activated by electrical discharge. The adhesive layer is then spread on the substrate and exposed to mid-infrared light, allowing the particles to form the desired circuit pattern. Another notable patent is an audio signal amplifying circuit designed for electronic devices. This circuit includes an amplifying circuit and an inverting circuit that controls the operation mode of the amplifying circuit.

Career Highlights

Lin-Kun Ding has worked with notable companies such as Hon Hai Precision Industry Co., Ltd. and Hong-Fu Jin Precision Industry (Shenzhen) Co., Ltd. His experience in these organizations has contributed to his expertise in circuit board technology and electronic device innovation.

Collaborations

Throughout his career, Lin-Kun Ding has collaborated with talented individuals, including Shih-Fang Wong and Tsung-Jen Chuang. These collaborations have fostered a creative environment that has led to the development of groundbreaking technologies.

Conclusion

Lin-Kun Ding's contributions to circuit board technology and electronic devices highlight his role as an influential inventor. His innovative methods and collaborative efforts continue to shape the future of electronics.