The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 30, 2014
Filed:
Dec. 29, 2011
Tsung-jen Chuang, New Taipei, TW;
Shih-fang Wong, New Taipei, TW;
Jiang-feng Shan, Shenzhen, CN;
Lin-kun Ding, Shenzhen, CN;
Tsung-Jen Chuang, New Taipei, TW;
Shih-Fang Wong, New Taipei, TW;
Jiang-Feng Shan, Shenzhen, CN;
Lin-Kun Ding, Shenzhen, CN;
Fu Tai Hua Industry (Shenzhen) Co., Ltd., Shenzhen, CN;
Hon Hai Precision Industry Co., Ltd., New Taipei, TW;
Abstract
An exemplary method for manufacturing a circuit board includes, firstly, obtaining an insulating substrate, liquid heat-curable adhesive and electrically conductive particles. The electrically conductive particles are added into the liquid heat-curable adhesive. The electrically conductive particles in the heat-curable adhesive are activated by electrical discharge. Secondly, the liquid heat-curable adhesive having activated electrically conductive particles are spread on the insulating substrate to form a heat-curable adhesive layer on the insulating substrate. Thirdly, the heat-curable adhesive layer are exposed to the mid-infrared light by using a photo-mask, the photo-mask has a pattern corresponding to a desired circuit pattern of the circuit board. The electrically conductive particles relocated themselves one by one to form the circuit pattern under irradiation by the mid-infrared light. Finally, the heat-curable adhesive layer are hardening.