This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Wolfspeed, Inc.. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: Liew Soon Lee: Innovator in Semiconductor Technology
Introduction
Liew Soon Lee is a notable inventor based in Ipoh, Malaysia. He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent.
Latest Patents
Liew Soon Lee holds a patent titled "Power package having connected components and processes implementing the same." This semiconductor package includes a metal submount, at least one transistor die arranged on the metal submount, and one or more metal contacts configured to be located adjacent to the metal submount by a connection. The connection can be established through various methods, including spot welding, laser beam modification, ultrasonic welding, electric resistance welding, and fused metal welding.
Career Highlights
Liew Soon Lee is currently employed at Wolfspeed, Inc., a company known for its advancements in semiconductor technology. His work focuses on developing innovative solutions that enhance the performance and efficiency of semiconductor packages.
Collaborations
Liew collaborates with talented individuals in his field, including coworkers Alexander Komposch and Eng Wah Woo. Their combined expertise contributes to the success of their projects and the advancement of semiconductor technology.
Conclusion
Liew Soon Lee's contributions to semiconductor technology through his patent and work at Wolfspeed, Inc. highlight his role as an innovator in the industry. His dedication to advancing technology continues to make a significant impact.