This inventor holds 1 USPTO granted patent. Top assignee: Semiconductor Manufacturing International (Shanghai) Corporation. Active years: 2012.
Company Filing History:
Years Active: 2012
Title: Innovations by Lien Hung Cheng in Integrated Circuit Technology.
Introduction
Lien Hung Cheng is an accomplished inventor based in Shanghai, China. He has made significant contributions to the field of integrated circuits, showcasing his expertise through innovative patent filings. His work focuses on enhancing the efficiency and performance of semiconductor devices.
Latest Patents
Lien Hung Cheng holds a patent for a method related to contact structures and methods for integrated circuits. The patent describes a method for fabricating an integrated circuit device that includes providing a semiconductor substrate with distinct regions. The process involves forming a stop layer and a low k dielectric layer, followed by the creation of a cap layer. Notably, the method initiates the formation of multiple via structures while simultaneously addressing isolated structures, showcasing a sophisticated approach to semiconductor fabrication. He has 1 patent to his name.
Career Highlights
Lien Hung Cheng is currently employed at Semiconductor Manufacturing International Corporation, a leading company in the semiconductor industry. His role involves working on advanced technologies that push the boundaries of integrated circuit design and manufacturing.
Collaborations
One of his notable coworkers is Man Hua Chen, who contributes to the innovative environment at their workplace. Together, they collaborate on projects that aim to advance semiconductor technology.
Conclusion
Lien Hung Cheng's contributions to integrated circuit technology reflect his dedication to innovation in the semiconductor field. His patent and ongoing work at Semiconductor Manufacturing International Corporation highlight his role as a key player in advancing technology.