Liang Yi Hung

Title: Liang Yi Hung: Semiconductor Packaging Inventor

Introduction

Liang Yi Hung is an inventor based in Taichung, Taiwan. His work includes semiconductor packaging technologies designed to support thinner packages and improve manufacturing reliability. He is credited with 2 patents.

Latest Patents

- Fabrication Method of Semiconductor Package. This invention describes forming a packaging substrate on a first carrier, bonding a second carrier to the substrate, and then removing the first carrier. A chip is placed on the substrate and encapsulated before the second carrier is removed. The carriers provide rigidity during fabrication, helping prevent cracking and warpage in thin substrates while supporting miniaturization and improved product yield.

- Semiconductor Package and Fabrication Method Thereof. This patent describes a similar carrier-supported process for manufacturing a semiconductor package. The first and second carriers stabilize the thin packaging substrate through key fabrication steps, reducing the risk of cracking or warpage and helping improve yield.

Career Highlights

Liang Yi Hung is associated with Siliconware Precision Industries Co., Ltd. His listed patent work focuses on semiconductor package fabrication and the challenges of processing thin substrates.

Collaborations

His listed coworkers include Chun Hsien Lin and Yu Cheng Pai.

Conclusion

Liang Yi Hung’s patent work addresses practical semiconductor packaging challenges by using temporary carriers to stabilize thin substrates, supporting miniaturization and more reliable manufacturing.