Taichung, Taiwan

Liang-Jie Lin

This inventor holds 2 USPTO granted patents. Top assignee: National Chung Hsing University. Active years: 2019-2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Liang-Jie Lin. Retrieved from https://idiyas.com/inventor/liang-jie-lin

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 4.0

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Company Filing History:


Years Active: 2019-2021

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2 patents (USPTO):Explore Patents

Title: Innovations of Liang-Jie Lin

Introduction

Liang-Jie Lin is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of materials science, particularly in the development of advanced conductive substrates and copper foil manufacturing techniques. With a total of 2 patents, his work has implications for various industries, including electronics and manufacturing.

Latest Patents

Liang-Jie Lin's latest patents include two innovative methods. The first patent is titled "Method for manufacturing copper foil with rough surface in plating tank and its product." This method involves causing an electrolyte solution to flow between an anode and a cathode with a current density of 5 ASF-40 ASF. The resulting copper foil features a rough surface with dense nodules of single copper crystals deposited on the cathode. The electrolyte solution comprises chloride ions, polyethylene glycol, sulfuric acid, copper sulfate pentahydrate, and a sulfur compound.

The second patent is "Method for producing flexible conductive substrate with high transmittance and product thereof." This method focuses on forming metal meshes on a flexible non-conductive substrate with high transmittance. Notably, this process does not require palladium as a catalyst. The resulting conductive substrate exhibits a high transmittance of 80%-90% at visible light wavelengths of 390-750 nm, making it suitable for various applications.

Career Highlights

Liang-Jie Lin is affiliated with National Chung Hsing University, where he continues to engage in research and development. His work has garnered attention for its innovative approaches to material production and application.

Collaborations

Liang-Jie Lin collaborates with esteemed colleagues such as Wei-Ping Dow and Chia-Hsiang Chen. Their combined expertise contributes to the advancement of research in their respective fields.

Conclusion

Liang-Jie Lin's contributions to the field of materials science through his innovative patents highlight his role as a leading inventor. His work not only advances technology but also paves the way for future developments in conductive materials.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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