The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11008665 B1

PDF
Full Text
Expired
Date of Patent:
May. 18, 2021

Filed:

May. 30, 2019
Applicant:

National Chung Hsing University, Taichung, TW;

Inventors:

Wei-Ping Dow, Taichung, TW;

Liang-Jie Lin, Taichung, TW;

Chia-Hsiang Chen, Taichung, TW;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B21C 37/00 (2006.01); C25D 1/04 (2006.01);
U.S. Cl.
CPC ...
C25D 1/04 (2013.01); Y10T 428/12431 (2015.01); Y10T 428/12993 (2015.01);
Abstract

A method for manufacturing a copper foil with a rough surface in a plating tank includes causing an electrolyte solution to flow between an anode and a cathode with a current density of 5 ASF-40 ASF. The copper foil with a rough surface including dense nodules of single copper crystals is deposited on the cathode. The electrolyte solution includes chloride ions (20 ppm-80 ppm), polyethylene glycol (PEG) with a molecular weight of 400-8000 (100 ppm-700 ppm), sulfuric acid (20 g/L-200 g/L), copper sulfate pentahydrate (70 g/L-320 g/L) and a sulfur compound (1 ppm-60 ppm).


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Dow, Wei-Ping. (2021). Method for manufacturing copper foil with rough surface in plating tank and its product (U.S. Patent No. 11008665). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11008665

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