Liang Cheng

Title: Innovations of Liang Cheng in Thermal Management

Introduction

Liang Cheng is a notable inventor based in San Diego, CA, who has made significant contributions to the field of thermal management in integrated circuits. With a total of 2 patents to his name, Cheng's work focuses on enhancing the efficiency of thermal management systems in portable computing devices.

Latest Patents

Cheng's latest patents include innovative solutions for thermal management of integrated circuits using phase change materials and heat spreaders. One of his patents describes an apparatus featuring passive thermal management that includes an integrated circuit die, a heat spreader thermally coupled to the die, and a phase change material (PCM) that is also thermally coupled to the heat spreader. This design allows for improved thermal dissipation, particularly with the inclusion of fins in the heat spreader, which enhances the efficiency of the system. Another patent outlines a system and method for use case-based thermal analysis of component combinations and layouts in portable computing devices. This invention allows for heuristic determination and thermal analysis of component placement on printed circuit boards, enabling users to identify the most efficient layouts for thermal dissipation.

Career Highlights

Liang Cheng is currently employed at Qualcomm Incorporated, a leading company in the field of telecommunications and semiconductor technology. His work at Qualcomm has positioned him as a key player in the development of advanced thermal management solutions.

Collaborations

Cheng has collaborated with notable colleagues such as Zhongping Bao and James D Burrell, contributing to the innovative environment at Qualcomm.

Conclusion

Liang Cheng's contributions to thermal management technology reflect his expertise and commitment to innovation. His patents not only enhance the efficiency of integrated circuits but also pave the way for future advancements in portable computing devices.