Hsinchu City, Taiwan

Li-Wei Chu

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Li-Wei Chu. Retrieved from https://idiyas.com/inventor/li-wei-chu-msado7sc

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Li-Wei Chu and Semiconductor Device Innovation

Introduction

Li-Wei Chu is an inventor associated with Hsinchu City, Taiwan. Her work includes a patent for a semiconductor device designed with multiple electrostatic discharge (ESD) paths.

Latest Patents

Chu is credited with 1 patent: “Semiconductor Device Having Multiple Electrostatic Discharge (ESD) Paths.” The invention describes a semiconductor device with doped regions and wells arranged to form an ESD path between an input/output pad and a voltage terminal. This design aims to provide a route for discharging electrostatic energy and protecting the device’s circuitry.

Career Highlights

Chu is associated with Taiwan Semiconductor Manufacturing Co., Ltd. Her patented work concerns semiconductor-device architecture and ESD protection, an important consideration in integrated circuit design.

Collaborations

The provided information lists PO-Lin Peng and Ming-Fu Tsai as Chu’s coworkers. It does not specify whether they collaborated on the patent.

Conclusion

Li-Wei Chu’s patent reflects a contribution to semiconductor design through an approach to managing electrostatic discharge and protecting device circuitry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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