Li-Ping Chen

Title: Innovations of Li-Ping Chen in Semiconductor Technology

Introduction

Li-Ping Chen is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly through his innovative designs and patents. His work has been instrumental in advancing the efficiency and reliability of semiconductor packages.

Latest Patents

Li-Ping Chen holds a patent for a "Leadframe with die pad." This invention includes a leadframe that features a die pad, a plurality of tie bars, metal extrusions, and leads arranged around the die pad. The design ensures that the tie bars are connected to the corners of the die pad, while the metal extrusions are linked to the sides but remain separate from the tie bars. Each metal extrusion is equipped with a locking hole and a bonding surface that is elevated above the die pad. This configuration enhances ground connections through wire-bonding and secures the die pad without stress transmission when exposed from an encapsulant in a semiconductor package.

Career Highlights

Li-Ping Chen is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to innovate in semiconductor technologies. His work has garnered attention for its practical applications and contributions to the industry.

Collaborations

Li-Ping has collaborated with several talented individuals, including Ying-Chen Sun and Kang-Wei Ma. These collaborations have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Li-Ping Chen's contributions to semiconductor technology through his patent and collaborative efforts highlight his role as an influential inventor in the field. His innovative designs continue to shape the future of semiconductor packaging.