This inventor holds 1 USPTO granted patent. Top assignee: Powerchip Semiconductor Manufacturing Corporation. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: Innovations of Li-Han Chiu in Wafer Stacking Technology
Introduction
Li-Han Chiu is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor manufacturing, particularly through his innovative patent related to wafer stacking processes. His work is instrumental in advancing technology in this critical area.
Latest Patents
Li-Han Chiu holds a patent for a wafer stacking process. This invention includes several steps: forming a silicon oxide layer on a sacrificial carrier, bonding this layer with a dielectric layer on the front side of a silicon substrate, and performing a thinning process on the back side of the silicon substrate to expose through-silicon vias (TSVs). The process continues with bonding the back side of the silicon substrate with another silicon substrate, repeating the thinning and bonding processes to create a wafer stacking structure, and finally removing the sacrificial carrier. This innovative approach enhances the efficiency and effectiveness of semiconductor devices.
Career Highlights
Li-Han Chiu is currently employed at Powerchip Semiconductor Manufacturing Corporation, where he applies his expertise in semiconductor technology. His work has contributed to the company's reputation as a leader in the semiconductor industry.
Collaborations
Li-Han Chiu collaborates with talented professionals in his field, including Chih-Feng Sung and Chih-Hao Chuang. These collaborations foster an environment of innovation and creativity, leading to advancements in semiconductor technologies.
Conclusion
Li-Han Chiu's contributions to wafer stacking technology exemplify the importance of innovation in the semiconductor industry. His patent and collaborative efforts continue to drive advancements in this critical field.